Toshiba
Toshiba KBG30ZMS256G Internal Solid State Drive KBG30ZMS256G
- UPC:
- 0000000000000
- MPN:
- KBG30ZMS256G
- Condition:
- New
- Availability:
- Available to Order: 3 - 4 weeks leadtime
Description
The BG3 series leverages 64-layer, 3-bit-per-cell (TLC) BiCS FLASH� and features NVMe� Revision 1.2.1. With Host Memory Buffer (HMB) technology, this SSD series retains high performance in a DRAM-less architecture, while enabling reduced power and a smaller footprint.
BG3 SSDs, as an innovative, next generation single-package ball grid array (BGA) SSD product line, harness the flexibility in system design that enables mobile computing and IoT embedded devices to be smaller, lighter, faster, and more power efficient. Also, these power-saving BG3 SSDs offer data center applications an alternative solution for server boot storage.
The BG3 series is available in 128GB, 256GB, and 512GB capacities. All three models are available in a surface-mount single package M.2 1620 or a removable module M.2 2230 form factor. BG3 SED models are also available.
Features
Component for
Notebook
Hardware encryption
No
Interface
PCI Express 3.1
Memory type
TLC
NVMe
Yes
NVMe version
1.2.1
Read speed
1400 MB/s
SSD capacity
256 GB
SSD form factor
M.2
Write speed
800 MB/s
Operational conditions
Operating temperature (T-T)
0 - 80 �C
Storage temperature (T-T)
-40 - 85 �C
Package dimensions
Gross Weight (Package, kg)
0.13 kg
Power
Operating voltage
3.3 V
Power consumption (read)
3.3 Watt
Power consumption (write)
3.3 Watt
Product dimensions
Net Weight (Product, kg)
0.1 kg
Product Depth
3 cm
Product Height
0.22 cm
Product Width
2.2 cm
Vendor information
Brand Name
Toshiba
Warranty
1 Year(s)
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BG3 SSDs, as an innovative, next generation single-package ball grid array (BGA) SSD product line, harness the flexibility in system design that enables mobile computing and IoT embedded devices to be smaller, lighter, faster, and more power efficient. Also, these power-saving BG3 SSDs offer data center applications an alternative solution for server boot storage.
The BG3 series is available in 128GB, 256GB, and 512GB capacities. All three models are available in a surface-mount single package M.2 1620 or a removable module M.2 2230 form factor. BG3 SED models are also available.
Features
Component for
Notebook
Hardware encryption
No
Interface
PCI Express 3.1
Memory type
TLC
NVMe
Yes
NVMe version
1.2.1
Read speed
1400 MB/s
SSD capacity
256 GB
SSD form factor
M.2
Write speed
800 MB/s
Operational conditions
Operating temperature (T-T)
0 - 80 �C
Storage temperature (T-T)
-40 - 85 �C
Package dimensions
Gross Weight (Package, kg)
0.13 kg
Power
Operating voltage
3.3 V
Power consumption (read)
3.3 Watt
Power consumption (write)
3.3 Watt
Product dimensions
Net Weight (Product, kg)
0.1 kg
Product Depth
3 cm
Product Height
0.22 cm
Product Width
2.2 cm
Vendor information
Brand Name
Toshiba
Warranty
1 Year(s)
Additional Information
Shipping: |
Available to Order - Call for ETA |
Delivery: |
Available to Order - Call for ETA |