ADATA AD5U560032G-S Memory Module 32 GB 1 X 32 GB DDR5 5600 MHz AD5U560032G-S

Higher Frequencies
The DDR5-5600 U-DIMM delivers blazing frequencies of up to 5600 MHz, a major leap from the max. frequency of DDR4 modules (3200 MHz).

More Energy-Efficient
This next-gen memory module operates on just 1.1V, making it 8% more power-efficient than DDR4. What's more, it features a built-in Power Management IC (PMIC) to enhanced power supply stability.

Capacity Doubled
This memory module's architecture allows for more memory bank groups and banks. With the same area, more bank groups can be packed into the module, doubling what was possible with DDR4, giving you higher capacities.

Improved Stability
With error correcting code (ECC) this module can correct errors automatically in real-time. In addition to greatly reducing the burden of CPU calculations, it also provides increased stability and reliability for enterprise-class computers.

QuikTips: DDR5 vs DDR4 - Appearance
DDR5 U-DIMM modules have the same dimensions and pin count as DDR4 modules. The most obvious difference is the position of the fool-proof notch. Also, DDR5 integrates I/O resistors with CMD/ADD resistors. Also, the appearance of DDR5 modules are cleaner than DDR4. In addition, you can see a PMIC in the center.

QuikTips: DDR5 vs DDR4 - Chip Architecture
DDR5 modules provide two times more capacity than DDR4 by packing in more banks and bank groups. In addition, Burst Length, Prefetch are also doubled, increasing the number of data writes and the amount of data taken upfront. And to ensure data integrity, they feature error correcting code (ECC) technology.

QuikTips: DDR5 vs DDR4 - Performance
The biggest change is that bandwidth and frequency are significantly higher. The ADATA DDR5 memory modules deliver frequencies of up to 4800MHz and feature bandwidth of 38.4GB/s, which is 50% higher than the DDR4-3200. The maximum frequency is increased 1.63 times compared to DDR4.

Specs




Features


Buffered memory type

Unregistered (unbuffered)


On-Die ECC




CAS latency

Column Address Strobe (CAS) latency, or CL, is the delay time between the moment a memory controller tells the memory module to access a particular memory column on a RAM module, and the moment the data from the given array location is available on the module's output pins. In general, the lower the CAS latency, the better.

46


Internal memory

A computer's memory which is directly accessible to the CPU.

32 GB


Memory layout (modules x size)

How the overall memory of the product is put together, defined by the number of modules and the size.

1 x 32 GB


Internal memory type

The type of internal memory such as RAM, GDDR5.

DDR5


Memory clock speed

The frequency at which the memory (e.g. RAM) runs.

5600 MHz


Component for

What this product is used as a part of (component for).

Laptop


Memory form factor

Design of the memory e.g. 240-pin DIMM, SO-DIMM.

288-pin DIMM


Memory voltage

The voltage (V) of the memory in the device.

1.1 V



Features


Module configuration
48M x 8


Operational conditions


Operating temperature (T-T)

The minimum and maximum temperatures at which the product can be safely operated.

0 - 85 ?C


Packaging data


Package width

The distance from one side of the packaging to the other.

55 mm


Package depth

The distance from the front to the back of the packaging.
0 mm


Package height

The distance from the top to the bottom of the packaging.

9 mm


Package weight

Weight of the packaged product.

26.5 g


Package type

The type of product package e.g. box.

Tray