Kingston Technology 2048G KC3000 M.2 2280 NVMe SSD SKC3000D/2048G

Kingston KC3000 PCIe 4.0 NVMe M.2 SSD delivers next-level performance using the latest Gen 4x4 NVMe controller and 3D TLC NAND. Upgrade the storage and reliability of your system to keep up with demanding workloads and experience better performance with software applications such as 3D rendering and 4K+ content creation. With formidable speeds up to 7,000MB/s* read/write, it ensures improved workflow in high-performance desktop and laptop PCs making it ideal for power users who require the fastest speeds on the market.

The compact M.2 2280 design fits seamlessly into motherboards and gives greater flexibility where high-power users appreciate responsiveness and superior loading times.

Full capacities available from 512GB–4096GB** to meet your data storage requirements.

PCIe 4.0 NVMe technology
Master intensive applications with speeds of up to 7,000/7,000MB/s* read/write.

Store more
Upgrade and manage storage with full capacities of up to 4096GB**.

Greater flexibility
Compact M.2 design fits easily into small-form-factor (SFF) systems, desktops and laptop PCs.

Low-profile graphene aluminium heat spreader
Exceptional thermal dissipation keeps your drive cool with maximum performance.

Specs




Features


SSD capacity

The Solid State Drive's data storage capacity.

2 TB


SSD form factor

The size of the solid-state drive, given in inches

M.2


Interface

Interface ports to connect pieces of equipment. USB (Universal Serial Bus) has become the most popular wired interface to connect peripherals. USB 2.0 supports speeds up to 480 Mbit/s (USB 1: 12 Mbit/s). The interface FireWire is also known as the IEEE 1394 standard. Enhanced IDE (EIDE)is sometimes referred to as Fast ATA, Fast IDE or ATA-2.

PCI Express 4.0


NVMe

NVM Express (NVMe) or Non-Volatile Memory Host Controller Interface Specification (NVMHCIS) is an open logical device interface specification for accessing non-volatile storage media attached via a PCI Express (PCIe) bus. NVM Express, as a logical device interface, has been designed to capitalize on the low latency and internal parallelism of solid-state storage devices.




Memory type

Type of memory in the device e.g. DDR3, SRAM (Static RAM).

3D TLC


Component for

What this product is used as a part of (component for).

PC/Laptop


M.2 SSD size

2280 (22 x 80 mm)


Read speed

The speed at which a device can read data.

7000 MB/s


Write speed

The speed at which a device can write data.

7000 MB/s


Random read (4KB)
00000 IOPS


Random write (4KB)
00000 IOPS


Controller type

Phison E18


Mean time between failures (MTBF)

Statistical model used to indicate product/mechanism reliability; expressed in hours and percentage of duty cycle. This number (in hours) does not indicate the mean time before failure for a single unit/mechanism.
00000 h


TBW rating
00


Power


Power consumption (read)

2.8 W


Power consumption (write)

9.9 W


Power consumption (average)

0.36 W


Power consumption (idle)

0.005 W


Weight & dimensions


Width

The measurement or extent of something from side to side.

80 mm



Weight & dimensions


Depth

The distance from the front to the back of something.

22 mm


Height

The measurement of the product from head to foot or from base to top.

3.5 mm


Weight

Weight of the product without packaging (net weight). If possible, the net weight is given including standard accessories and supplies. Please note that sometimes the manufacturer leaves out the weight of accessories and/or supplies.

9.7 g


Packaging data


Package width

The distance from one side of the packaging to the other.
9.5 mm


Package depth

The distance from the front to the back of the packaging.

8.38 mm


Package height

The distance from the top to the bottom of the packaging.
4.2 mm


Package weight

Weight of the packaged product.

34.03 g


Operational conditions


Operating temperature (T-T)

The minimum and maximum temperatures at which the product can be safely operated.

0 - 70 °C


Storage temperature (T-T)

The minimum and maximum temperatures at which the product can be safely stored.

-40 - 85 °C


Other features


Cooling type

The method used to cool the device or to cool the air around the device.

Heatsink


Logistics data


Country of origin

Country where the device is made. Aka Country of manufacture (COM).

China, Taiwan


Master (outer) case width
5.9 mm


Master (outer) case length
3.2 mm


Harmonized System (HS) code

84717070


Master (outer) case height

69.8 mm


Master (outer) case gross weight

418.29 g


Products per master (outer) case
pc(s)