Kingston Technology FURY 32GB 3200MT/s DDR4 CL20 SODIMM Kit of 2 Impact KF432S20IBK2/32

8GB, 16GB and 32GB capacities up to 3200MT/s
Get your notebook or small-form-factor machine fully equipped with Kingston FURY- Impact DDR4 SODIMM and minimise system lag. Ready for AMD Ryzen-, Intel- XMP-ready and XMP Certified in kit capacities of up to 64GB, FURY Impact DDR4 features Kingston-s innovative Plug N Play* overclocking technology, which automatically engages the factory preset speed and latency timings without having to change any settings in the BIOS. Designed to run cool, quiet and efficiently at only 1.2V, these sleek black modules provide a hassle-free boost to your system-s performance

Powerful SODIMM performance
Maximise your memory and get a boost to your gaming, multitasking and rendering.

Plug N Play automatic overclocking functionality*
Impact DDR4 automatically overclocks itself to the highest published frequency.

Intel- XMP-ready and XMP Certified
Designed to maximise the performance of our memory modules, our engineers have predefined Intel Extreme Memory Profiles to reach speeds of up to 3200MT/s.

Ready for AMD Ryzen-
Get memory that-s Ready for AMD Ryzen and will seamlessly integrate with your AMD-based SODIMM-compatible system. A reliable, compatible performance boost for your build.

Higher performance with low power consumption
Run your system cool and efficiently with Impact DDR4-s low 1.2V power draw.

Slim form factor, sleek design
The black PCB and sleek thermal label deliver big style with a small footprint.

Specs




Features


Buffered memory type

Unregistered (unbuffered)


CAS latency

Column Address Strobe (CAS) latency, or CL, is the delay time between the moment a memory controller tells the memory module to access a particular memory column on a RAM module, and the moment the data from the given array location is available on the module's output pins. In general, the lower the CAS latency, the better.



Internal memory

A computer's memory which is directly accessible to the CPU.

32 GB


Memory layout (modules x size)

How the overall memory of the product is put together, defined by the number of modules and the size.

2 x 16 GB


Internal memory type

The type of internal memory such as RAM, GDDR5.

DDR4


Memory data transfer rate

3200 MT/s


Component for

What this product is used as a part of (component for).

Laptop


Memory form factor

Design of the memory e.g. 240-pin DIMM, SO-DIMM.

260-pin SO-DIMM


ECC

ECC means Error Correction Code, and it is memory that is able to detect and correct some memory errors without user intervention.




Memory ranking

1


Memory voltage

The voltage (V) of the memory in the device.

1.2 V


Module configuration
48M x 64


Row cycle time

45.75 ns


Refresh row cycle time

350 ns


Row active time

26.25 ns


Intel Extreme Memory Profile (XMP)




Programming power voltage (VPP)

2.5 V


Country of origin

Country where the device is made. Aka Country of manufacture (COM).

China, Taiwan


Cooling type

The method used to cool the device or to cool the air around the device.

Heatsink


Backlight

Product has a built-in light source for its illuminating.





Features


JEDEC standard




Operational conditions


Operating temperature (T-T)

The minimum and maximum temperatures at which the product can be safely operated.

0 - 85 -C


Storage temperature (T-T)

The minimum and maximum temperatures at which the product can be safely stored.

-55 - 100 -C


Weight & dimensions


Width

The measurement or extent of something from side to side.

3.8 mm


Depth

The distance from the front to the back of something.

69.6 mm


Height

The measurement of the product from head to foot or from base to top.

30 mm


Weight

Weight of the product without packaging (net weight). If possible, the net weight is given including standard accessories and supplies. Please note that sometimes the manufacturer leaves out the weight of accessories and/or supplies.
.6 g


Packaging data


Package width

The distance from one side of the packaging to the other.

95.2 mm


Package depth

The distance from the front to the back of the packaging.
mm


Package height

The distance from the top to the bottom of the packaging.
1.4 mm


Package weight

Weight of the packaged product.

45.6 g


Logistics data


Master (outer) case width
3.2 mm


Master (outer) case length

311.1 mm


Master (outer) case height
1.6 mm


Harmonized System (HS) code

84733020


Master (outer) case gross weight

1.35 kg


Products per master (outer) case

25 pc(s)