Kingston
Kingston Technology FURY Beast 16GB 3200MT/s DDR4 CL16 DIMM Kit of 2 RGB KF432C16BB2AK2/16
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- UPC:
- 0000000000000
- MPN:
- KF432C16BB2AK2/16
- Condition:
- New
- Availability:
- Available with FREE Delivery (usually delivered within 5-7 working days)
Description
Kingston FURY™ Beast DDR4 RGB Memory
Kingston FURY™ Beast DDR4 RGB memory upgrades the style and performance of any system. Featuring stunning RGB lighting* to complement the sleek black heat spreader and impressive speeds of up to 3733MT/s[*]. Choose between Intel® XMP Certified & XMP-Ready profiles, Ready for AMD Ryzen™ or go for Plug N Play** automatic overclocking at 2666MT/s to get the boost you need for work and play.
Customisable RGB lighting* with sleek styling
Transform your system using Kingston FURY™ CTRL to choose from over a dozen lighting patterns or customise RGB effects on the sleek heat spreader.
Kingston FURY™ Infrared Sync Technology™
Keep RGB lighting effects in sync with patented Kingston FURY Infrared Sync Technology.
Intel® XMP Certified and XMP-Ready
Our engineers have predefined [Intel Extreme Memory Profiles] to reach speeds of up to 3733MT/s[*] to get the most out of your memory.
Ready for AMD Ryzen™
Trust your AMD-based system to get down to business in-app or in-game with memory that’s ready for Ryzen.
Plug N Play – Automatic overclocking up to 2666MT/s**
For a reliable and compatible upgrade, Kingston FURY Beast DDR4 RGB Plug N Play modules will auto-overclock to the highest listed speed allowed by system BIOS.
Specs
Features
Buffered memory type
Unregistered (unbuffered)
CAS latency
Column Address Strobe (CAS) latency, or CL, is the delay time between the moment a memory controller tells the memory module to access a particular memory column on a RAM module, and the moment the data from the given array location is available on the module's output pins. In general, the lower the CAS latency, the better.
Internal memory
A computer's memory which is directly accessible to the CPU.
GB
Memory layout (modules x size)
How the overall memory of the product is put together, defined by the number of modules and the size.
2 x 8 GB
Internal memory type
The type of internal memory such as RAM, GDDR5.
DDR4
Memory data transfer rate
3200 MT/s
Component for
What this product is used as a part of (component for).
PC
Memory form factor
Design of the memory e.g. 240-pin DIMM, SO-DIMM.
288-pin DIMM
ECC
ECC means Error Correction Code, and it is memory that is able to detect and correct some memory errors without user intervention.
Memory ranking
1
Memory voltage
The voltage (V) of the memory in the device.
1.35 V
Module configuration
24M x 64
Row cycle time
45.75 ns
Refresh row cycle time
350 ns
Row active time
32 ns
Intel Extreme Memory Profile (XMP)
Intel Extreme Memory Profile (XMP) version
2.0
SPD profile
Programming power voltage (VPP)
2.5 V
Country of origin
Country where the device is made. Aka Country of manufacture (COM).
China, Taiwan
Cooling type
The method used to cool the device or to cool the air around the device.
Heatsink
Features
Lead plating
Gold
Backlight
Product has a built-in light source for its illuminating.
Backlight colour
Red/Green/Blue
JEDEC standard
Operational conditions
Operating temperature (T-T)
The minimum and maximum temperatures at which the product can be safely operated.
0 - 70 °C
Storage temperature (T-T)
The minimum and maximum temperatures at which the product can be safely stored.
-40 - 85 °C
Weight & dimensions
Width
The measurement or extent of something from side to side.
8.2 mm
Depth
The distance from the front to the back of something.
3.3 mm
Height
The measurement of the product from head to foot or from base to top.
43 mm
Weight
Weight of the product without packaging (net weight). If possible, the net weight is given including standard accessories and supplies. Please note that sometimes the manufacturer leaves out the weight of accessories and/or supplies.
93.64 g
Packaging data
Package width
The distance from one side of the packaging to the other.
1.9 mm
Package depth
The distance from the front to the back of the packaging.
mm
Package height
The distance from the top to the bottom of the packaging.
1.4 mm
Package weight
Weight of the packaged product.
0.99 g
Logistics data
Master (outer) case width
1.6 mm
Master (outer) case length
254 mm
Master (outer) case height
7.3 mm
Master (outer) case gross weight
2.16 kg
Products per master (outer) case
pc(s)
View AllClose
Kingston FURY™ Beast DDR4 RGB memory upgrades the style and performance of any system. Featuring stunning RGB lighting* to complement the sleek black heat spreader and impressive speeds of up to 3733MT/s[*]. Choose between Intel® XMP Certified & XMP-Ready profiles, Ready for AMD Ryzen™ or go for Plug N Play** automatic overclocking at 2666MT/s to get the boost you need for work and play.
Customisable RGB lighting* with sleek styling
Transform your system using Kingston FURY™ CTRL to choose from over a dozen lighting patterns or customise RGB effects on the sleek heat spreader.
Kingston FURY™ Infrared Sync Technology™
Keep RGB lighting effects in sync with patented Kingston FURY Infrared Sync Technology.
Intel® XMP Certified and XMP-Ready
Our engineers have predefined [Intel Extreme Memory Profiles] to reach speeds of up to 3733MT/s[*] to get the most out of your memory.
Ready for AMD Ryzen™
Trust your AMD-based system to get down to business in-app or in-game with memory that’s ready for Ryzen.
Plug N Play – Automatic overclocking up to 2666MT/s**
For a reliable and compatible upgrade, Kingston FURY Beast DDR4 RGB Plug N Play modules will auto-overclock to the highest listed speed allowed by system BIOS.
Specs
Features
Buffered memory type
Unregistered (unbuffered)
CAS latency
Column Address Strobe (CAS) latency, or CL, is the delay time between the moment a memory controller tells the memory module to access a particular memory column on a RAM module, and the moment the data from the given array location is available on the module's output pins. In general, the lower the CAS latency, the better.
Internal memory
A computer's memory which is directly accessible to the CPU.
GB
Memory layout (modules x size)
How the overall memory of the product is put together, defined by the number of modules and the size.
2 x 8 GB
Internal memory type
The type of internal memory such as RAM, GDDR5.
DDR4
Memory data transfer rate
3200 MT/s
Component for
What this product is used as a part of (component for).
PC
Memory form factor
Design of the memory e.g. 240-pin DIMM, SO-DIMM.
288-pin DIMM
ECC
ECC means Error Correction Code, and it is memory that is able to detect and correct some memory errors without user intervention.
Memory ranking
1
Memory voltage
The voltage (V) of the memory in the device.
1.35 V
Module configuration
24M x 64
Row cycle time
45.75 ns
Refresh row cycle time
350 ns
Row active time
32 ns
Intel Extreme Memory Profile (XMP)
Intel Extreme Memory Profile (XMP) version
2.0
SPD profile
Programming power voltage (VPP)
2.5 V
Country of origin
Country where the device is made. Aka Country of manufacture (COM).
China, Taiwan
Cooling type
The method used to cool the device or to cool the air around the device.
Heatsink
Features
Lead plating
Gold
Backlight
Product has a built-in light source for its illuminating.
Backlight colour
Red/Green/Blue
JEDEC standard
Operational conditions
Operating temperature (T-T)
The minimum and maximum temperatures at which the product can be safely operated.
0 - 70 °C
Storage temperature (T-T)
The minimum and maximum temperatures at which the product can be safely stored.
-40 - 85 °C
Weight & dimensions
Width
The measurement or extent of something from side to side.
8.2 mm
Depth
The distance from the front to the back of something.
3.3 mm
Height
The measurement of the product from head to foot or from base to top.
43 mm
Weight
Weight of the product without packaging (net weight). If possible, the net weight is given including standard accessories and supplies. Please note that sometimes the manufacturer leaves out the weight of accessories and/or supplies.
93.64 g
Packaging data
Package width
The distance from one side of the packaging to the other.
1.9 mm
Package depth
The distance from the front to the back of the packaging.
mm
Package height
The distance from the top to the bottom of the packaging.
1.4 mm
Package weight
Weight of the packaged product.
0.99 g
Logistics data
Master (outer) case width
1.6 mm
Master (outer) case length
254 mm
Master (outer) case height
7.3 mm
Master (outer) case gross weight
2.16 kg
Products per master (outer) case
pc(s)
Additional Information
Shipping: |
Usually shipped within 3-5 working days |
Delivery: |
Usually delivered within 5-7 working days |
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