Kingston
Kingston Technology FURY 32GB 3600MT/s DDR4 CL16 DIMM Kit of 2 2RX8 Renegade Bla KF436C16RB12K2/32
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- UPC:
- 0000000000000
- MPN:
- KF436C16RB12K2/32
- Condition:
- New
- Availability:
- Available with FREE Delivery (usually delivered within 5-7 working days)
Description
Enhance AMD- or Intel-based systems with ultra-fast Kingston FURY™ Renegade DDR4 memory, ensuring you maintain peak performance levels. Combine speeds of up to 5333MT/s[*]* with quick CL16-CL20 timings to increase frame rate, keep streams smooth and edit all your content in a flash. The bold, two-tone black heat spreader with black PCB not only adds a touch of style but also manages heat while tackling heavy workloads. Available in single module capacities of 8GB–32GB and kits of 2, 4 and 8 with capacities of 16GB–256GB. Kingston FURY Renegade DDR4 is Ready for AMD Ryzen, Intel® XMP Certified and XMP Ready. You’re ready to go with profiles that are optimised for AMD and Intel’s latest chipsets.
High speeds plus low latencies for extreme performance
With speeds of up to 5333MT/s* paired with quick CL16–CL20 timings to help your AMD- or Intel-based system power through games, video editing and broadcasting, [Kingston FURY Renegade DDR4] is the prime choice to meet demands.
Intel® XMP Certified or Ready
Intel Extreme Memory Profile technology makes it possible to overclock with ease. Select one of the built-in, hand-tuned profiles in your BIOS to get the benefits of overclocking without having to manually adjust the memory timings yourself.
Ready for AMD Ryzen
Get memory that’s Ready for Ryzen and will seamlessly integrate with your AMD-based system. A reliable, compatible performance boost for your build.
Intense black aluminium heat spreader
The two-tone black aluminium heat spreader and black PCB keep your rig running and looking sharp.
Specs
Features
Buffered memory type
Unregistered (unbuffered)
CAS latency
Column Address Strobe (CAS) latency, or CL, is the delay time between the moment a memory controller tells the memory module to access a particular memory column on a RAM module, and the moment the data from the given array location is available on the module's output pins. In general, the lower the CAS latency, the better.
Internal memory
A computer's memory which is directly accessible to the CPU.
32 GB
Memory layout (modules x size)
How the overall memory of the product is put together, defined by the number of modules and the size.
2 x 16 GB
Internal memory type
The type of internal memory such as RAM, GDDR5.
DDR4
Memory data transfer rate
3600 MT/s
Component for
What this product is used as a part of (component for).
PC
Memory form factor
Design of the memory e.g. 240-pin DIMM, SO-DIMM.
288-pin DIMM
ECC
ECC means Error Correction Code, and it is memory that is able to detect and correct some memory errors without user intervention.
Memory channels
Dual-channel
Memory ranking
2
Memory voltage
The voltage (V) of the memory in the device.
1.35 V
Module configuration
48M x 64
Row cycle time
45.75 ns
Refresh row cycle time
350 ns
Row active time
32 ns
Intel Extreme Memory Profile (XMP)
Intel Extreme Memory Profile (XMP) version
2.0
SPD profile
Programming power voltage (VPP)
2.5 V
Country of origin
Country where the device is made. Aka Country of manufacture (COM).
China, Taiwan
Features
Cooling type
The method used to cool the device or to cool the air around the device.
Heatsink
Lead plating
Gold
JEDEC standard
Operational conditions
Operating temperature (T-T)
The minimum and maximum temperatures at which the product can be safely operated.
0 - 85 °C
Storage temperature (T-T)
The minimum and maximum temperatures at which the product can be safely stored.
-55 - 100 °C
Weight & dimensions
Width
The measurement or extent of something from side to side.
8.29 mm
Depth
The distance from the front to the back of something.
3.3 mm
Height
The measurement of the product from head to foot or from base to top.
42 mm
Weight
Weight of the product without packaging (net weight). If possible, the net weight is given including standard accessories and supplies. Please note that sometimes the manufacturer leaves out the weight of accessories and/or supplies.
82.86 g
Packaging data
Package width
The distance from one side of the packaging to the other.
9.5 mm
Package depth
The distance from the front to the back of the packaging.
mm
Package height
The distance from the top to the bottom of the packaging.
1.4 mm
Package weight
Weight of the packaged product.
3.23 g
Package type
The type of product package e.g. box.
Box
Logistics data
Master (outer) case width
1.6 mm
Master (outer) case length
254 mm
Master (outer) case height
7.3 mm
Master (outer) case gross weight
2.34 kg
Products per master (outer) case
pc(s)
View AllClose
High speeds plus low latencies for extreme performance
With speeds of up to 5333MT/s* paired with quick CL16–CL20 timings to help your AMD- or Intel-based system power through games, video editing and broadcasting, [Kingston FURY Renegade DDR4] is the prime choice to meet demands.
Intel® XMP Certified or Ready
Intel Extreme Memory Profile technology makes it possible to overclock with ease. Select one of the built-in, hand-tuned profiles in your BIOS to get the benefits of overclocking without having to manually adjust the memory timings yourself.
Ready for AMD Ryzen
Get memory that’s Ready for Ryzen and will seamlessly integrate with your AMD-based system. A reliable, compatible performance boost for your build.
Intense black aluminium heat spreader
The two-tone black aluminium heat spreader and black PCB keep your rig running and looking sharp.
Specs
Features
Buffered memory type
Unregistered (unbuffered)
CAS latency
Column Address Strobe (CAS) latency, or CL, is the delay time between the moment a memory controller tells the memory module to access a particular memory column on a RAM module, and the moment the data from the given array location is available on the module's output pins. In general, the lower the CAS latency, the better.
Internal memory
A computer's memory which is directly accessible to the CPU.
32 GB
Memory layout (modules x size)
How the overall memory of the product is put together, defined by the number of modules and the size.
2 x 16 GB
Internal memory type
The type of internal memory such as RAM, GDDR5.
DDR4
Memory data transfer rate
3600 MT/s
Component for
What this product is used as a part of (component for).
PC
Memory form factor
Design of the memory e.g. 240-pin DIMM, SO-DIMM.
288-pin DIMM
ECC
ECC means Error Correction Code, and it is memory that is able to detect and correct some memory errors without user intervention.
Memory channels
Dual-channel
Memory ranking
2
Memory voltage
The voltage (V) of the memory in the device.
1.35 V
Module configuration
48M x 64
Row cycle time
45.75 ns
Refresh row cycle time
350 ns
Row active time
32 ns
Intel Extreme Memory Profile (XMP)
Intel Extreme Memory Profile (XMP) version
2.0
SPD profile
Programming power voltage (VPP)
2.5 V
Country of origin
Country where the device is made. Aka Country of manufacture (COM).
China, Taiwan
Features
Cooling type
The method used to cool the device or to cool the air around the device.
Heatsink
Lead plating
Gold
JEDEC standard
Operational conditions
Operating temperature (T-T)
The minimum and maximum temperatures at which the product can be safely operated.
0 - 85 °C
Storage temperature (T-T)
The minimum and maximum temperatures at which the product can be safely stored.
-55 - 100 °C
Weight & dimensions
Width
The measurement or extent of something from side to side.
8.29 mm
Depth
The distance from the front to the back of something.
3.3 mm
Height
The measurement of the product from head to foot or from base to top.
42 mm
Weight
Weight of the product without packaging (net weight). If possible, the net weight is given including standard accessories and supplies. Please note that sometimes the manufacturer leaves out the weight of accessories and/or supplies.
82.86 g
Packaging data
Package width
The distance from one side of the packaging to the other.
9.5 mm
Package depth
The distance from the front to the back of the packaging.
mm
Package height
The distance from the top to the bottom of the packaging.
1.4 mm
Package weight
Weight of the packaged product.
3.23 g
Package type
The type of product package e.g. box.
Box
Logistics data
Master (outer) case width
1.6 mm
Master (outer) case length
254 mm
Master (outer) case height
7.3 mm
Master (outer) case gross weight
2.34 kg
Products per master (outer) case
pc(s)
Additional Information
Shipping: |
Usually shipped within 3-5 working days |
Delivery: |
Usually delivered within 5-7 working days |
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