Kingston Technology FURY Beast 128GB 5600MT/s DDR5 CL40 DIMM Kit of 4 Black XMP KF556C40BBK4-128

Up to 6800MT/s
Kingston FURY™ Beast DDR5 memory provides superb speed, capacity and reliability for next-gen gaming platforms. Level up your machine’s performance with enhanced features like on-die ECC for better stability and dual 32-bit subchannels to boost efficiency. Kingston FURY Beast DDR5 offers overclock specs for Intel® XMP 3.0 and AMD EXPO™ with customisable profiles for speeds and timings to help you wring the most from your gaming experience, livestream at 4K+ or push animation and 3D rendering projects.

Kingston FURY™ Beast DDR5 memory brings the latest, cutting-edge technology for next-gen gaming platforms. Taking speed, capacity and reliability even further, DDR5 arrives with an arsenal of enhanced features, like on-die ECC (ODECC) for improved stability at extreme speeds, dual 32-bit subchannels for increased efficiency and an on-module power management integrated circuit (PMIC) to provide juice where it’s needed most.

Superior speed advancements, with double the banks from 16 to 32 and double the burst length from 8 to 16, take DDR5 memory, your gaming experience and your overall system applications to the next level of performance.
Whether you’re pushing the limits in your gaming with the most extreme settings, live streaming at 4K+ or pushing large animation and 3D rendering, Kingston FURY Beast DDR5 memory is the level-up needed, while seamlessly bridging style and unleashing performance.

With options featuring Intel XMP 3.0 or AMD EXPO, two new DDR5 overclock specs that include customisable profiles for speeds and timings, Kingston FURY Beast DDR5 has your compatible overclock solutions covered."

Improved stability for overclocking
On-die ECC (ODECC) helps maintain data integrity to sustain the ultimate performance while you push the limits!

Increased efficiency
Boosted by double the banks and burst length and two independent 32-bit subchannels, DDR5’s exceptional handling of data shines with the latest games, programs and demanding applications.

Intel® XMP 3.0 certified
Advanced pre-optimised timings, speed and voltage for overclocking performance and save new user-customisable profiles using a programmable PMIC.

AMD EXPO certified
AMD EXPO (Extended Profiles for Overclocking) Certified modules include Intel XMP 3.0 profiles, enabling compatibility with the platform of your choice.

Qualified by the world’s leading motherboard manufacturers*
Tested and approved so you can build and upgrade with confidence on your preferred motherboard.

Low-profile heat spreader
Newly designed heat spreaders in black or white combine bold styling and outstanding cooling functionality.

Specs




Features


Buffered memory type

Unregistered (unbuffered)


On-Die ECC




CAS latency

Column Address Strobe (CAS) latency, or CL, is the delay time between the moment a memory controller tells the memory module to access a particular memory column on a RAM module, and the moment the data from the given array location is available on the module's output pins. In general, the lower the CAS latency, the better.

40


Internal memory

A computer's memory which is directly accessible to the CPU.
8 GB


Memory layout (modules x size)

How the overall memory of the product is put together, defined by the number of modules and the size.

4 x 32 GB


Internal memory type

The type of internal memory such as RAM, GDDR5.

DDR5


Memory data transfer rate

5600 MT/s


Component for

What this product is used as a part of (component for).

PC


Memory form factor

Design of the memory e.g. 240-pin DIMM, SO-DIMM.

288-pin DIMM


ECC

ECC means Error Correction Code, and it is memory that is able to detect and correct some memory errors without user intervention.




Memory channels

Quad-channel


Memory ranking

2


Memory voltage

The voltage (V) of the memory in the device.

1.25 V


Module configuration

4096M x 64


Row cycle time

48 ns


Refresh row cycle time

295 ns


Row active time

32 ns


Intel Extreme Memory Profile (XMP)




Intel Extreme Memory Profile (XMP) version

3.0


SPD profile




Programming power voltage (VPP)

1.8 V


SPD voltage

1.1 V


SPD latency

39


SPD speed

4800 MHz



Features


Country of origin

Country where the device is made. Aka Country of manufacture (COM).

China, Taiwan


Product colour

The colour e.g. red, blue, green, black, white.

Black


Cooling type

The method used to cool the device or to cool the air around the device.

Heatsink


Lead plating

Gold


JEDEC standard




Operational conditions


Operating temperature (T-T)

The minimum and maximum temperatures at which the product can be safely operated.

0 - 85 °C


Storage temperature (T-T)

The minimum and maximum temperatures at which the product can be safely stored.

-55 - 100 °C


Weight & dimensions


Width

The measurement or extent of something from side to side.

6.62 mm


Depth

The distance from the front to the back of something.
3.3 mm


Height

The measurement of the product from head to foot or from base to top.

34.9 mm


Weight

Weight of the product without packaging (net weight). If possible, the net weight is given including standard accessories and supplies. Please note that sometimes the manufacturer leaves out the weight of accessories and/or supplies.
8.36 g


Packaging data


Package width

The distance from one side of the packaging to the other.

95.2 mm


Package depth

The distance from the front to the back of the packaging.

25.4 mm


Package height

The distance from the top to the bottom of the packaging.
1.4 mm


Package weight

Weight of the packaged product.
1.99 g


Package type

The type of product package e.g. box.

Blister


Logistics data


Master (outer) case width
3.2 mm


Master (outer) case length

311.1 mm


Master (outer) case height
1.6 mm


Master (outer) case gross weight

2.23 kg


Products per master (outer) case
pc(s)