Kingston

Kingston Technology FURY Beast 64GB 6000MT/s DDR5 CL36 DIMM Kit of 2 White RGB E KF560C36BWEAK2-64

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UPC:
0740617333480
MPN:
KF560C36BWEAK2-64
Condition:
New
Availability:
Available with FREE Delivery (usually delivered within 5-7 working days)
£907.19

Description

Kingston FURY™ Beast DDR5 RGB Memory - up to 6800MT/s
Kingston FURY™ Beast DDR5 RGB delivers speeds of up to 6800MT/s. Featuring Infrared Sync Technology™ to keep the vibrant customisable lighting in perfect sync, available with sleek black or white heat spreaders and support for Intel® XMP 3.0 and AMD EXPO™, it’s 100% speed tested and backed by a limited lifetime warranty.

Kingston FURY™ Beast DDR5 RGB* lets you overclock in style on next-gen gaming platforms with cutting-edge technology. Experience the superior speed advancements of DDR5 with double the banks and double the burst length.

Vibrant RGB lighting customisable with Kingston FURY CTRL software and patented Infrared Sync TechnologyTM, along with the new heat spreader designs in black or white, sets you apart in and out of the game.

Kingston FURY Beast DDR5 RGB features Intel XMP 3.0 or AMD EXPO options, two new DDR5 overclock specs that include customisable profiles for speeds and timings. 100% tested at speed and backed by a limited lifetime warranty.

Enhanced lighting with new heat spreader design
Game in style by customising the black or white heat spreaders with the smooth, stunning range of 18 RGB lighting* effects using Kingston FURY CTRL™ or the motherboard manufacturer’s software.

Patented Kingston FURY Infrared Sync Technology™
Vibrant RGB effects light in unison with Kingston’s patented Infrared Sync Technology.

Intel® XMP 3.0 certified
Advanced pre-optimised timings, speed and voltage for overclocking performance and save new user-customisable profiles using a programmable PMIC.

AMD EXPO certified
AMD EXPO (Extended Profiles for Overclocking) Certified modules include Intel XMP 3.0 profiles, enabling compatibility with the platform of your choice.

Qualified by the world’s leading motherboard manufacturers**
Tested and trusted for your preferred motherboard so you can build with confidence.

Improved stability for overclocking
On-die ECC (ODECC) helps maintain data integrity to sustain ultimate performance

Specs




Features


Buffered memory type

Unregistered (unbuffered)


On-Die ECC




CAS latency

Column Address Strobe (CAS) latency, or CL, is the delay time between the moment a memory controller tells the memory module to access a particular memory column on a RAM module, and the moment the data from the given array location is available on the module's output pins. In general, the lower the CAS latency, the better.

36


Internal memory

A computer's memory which is directly accessible to the CPU.

64 GB


Memory layout (modules x size)

How the overall memory of the product is put together, defined by the number of modules and the size.

2 x 32 GB


Internal memory type

The type of internal memory such as RAM, GDDR5.

DDR5


Memory data transfer rate

6000 MT/s


Component for

What this product is used as a part of (component for).

PC


Memory form factor

Design of the memory e.g. 240-pin DIMM, SO-DIMM.

288-pin DIMM


ECC

ECC means Error Correction Code, and it is memory that is able to detect and correct some memory errors without user intervention.




Memory ranking

2


Memory voltage

The voltage (V) of the memory in the device.

1.35 V


Module configuration

4096M x 64


Row cycle time

48 ns


Refresh row cycle time

295 ns


Row active time

32 ns


AMD Extended Profiles for Overclocking (EXPO)




AMD Extended Profiles for Overclocking (EXPO) version

1.0


SPD profile




Programming power voltage (VPP)

1.8 V


Country of origin

Country where the device is made. Aka Country of manufacture (COM).

China, Taiwan


Cooling type

The method used to cool the device or to cool the air around the device.

Heatsink



Features


Lead plating

Gold


Backlight

Product has a built-in light source for its illuminating.




Backlight colour

Red/Green/Blue


JEDEC standard




Operational conditions


Operating temperature (T-T)

The minimum and maximum temperatures at which the product can be safely operated.

0 - 85 °C


Storage temperature (T-T)

The minimum and maximum temperatures at which the product can be safely stored.

-55 - 100 °C


Weight & dimensions


Width

The measurement or extent of something from side to side.

7.11 mm


Depth

The distance from the front to the back of something.
3.3 mm


Height

The measurement of the product from head to foot or from base to top.

42.2 mm


Weight

Weight of the product without packaging (net weight). If possible, the net weight is given including standard accessories and supplies. Please note that sometimes the manufacturer leaves out the weight of accessories and/or supplies.

87.84 g


Packaging data


Package width

The distance from one side of the packaging to the other.
1.9 mm


Package depth

The distance from the front to the back of the packaging.
mm


Package height

The distance from the top to the bottom of the packaging.
1.4 mm


Package weight

Weight of the packaged product.
3.11 g


Logistics data


Master (outer) case width
1.6 mm


Master (outer) case length

254 mm


Master (outer) case height
7.3 mm


Master (outer) case gross weight

2.19 kg


Products per master (outer) case
pc(s)
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Additional Information

Shipping:
Usually shipped within 3-5 working days
Delivery:
Usually delivered within 5-7 working days
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