Team Group ELITE memory module 16 GB 1 x 16 GB DDR5 TED516G5600C4601

Increased Fundamental Frequency, Faster Speeds
Minimum specifications reach an ultra-high frequency of 4800MHz, 50% more from the 3200MHz standard frequency maximum of DDR4 modules. Let our DDR5 help you breeze through all your boring, mundane tasks.

Unleashed Capacity, Stronger Multitasking
DDR5 kit is available from a 8GB capacity per module and, in compliance with JEDEC standards, can be expanded to 128GB capacity to uncap your memory and deliver a smooth multitasking experience.

Improved Structural Composition, Greater Efficiency
Factors critical to improved performance include increased banks and burst lengths. DDR5 allows up to 32 banks (storage units that can be enabled/disabled separately) comprised from 8 bank groups, doubling the access availability from the 16 banks available in DDR4 standards; the DDR5 burst length (amount of data that can be accessed from a single DRAM read/write command) is also twice as much as DDR4 burst lengths.

Reduced Working Voltage, Better Energy Efficiency
Standard working voltage has been reduced from the 1.2V in DDR4 modules to 1.1V, reducing energy consumption for each bandwidth to conserve energy and reduce your burden. To minimize noise interference, the power management has been transferred from motherboard to RAM and will be complimented with a PMIC for effective system load management.

On-die ECC, Stable Performance
DDR5 memory modules support on-die ECCs, a feature that self-corrects DRAM cells, to deliver stability to DRAM systems using DDR5.

Specs




Features


Buffered memory type

Unregistered (unbuffered)


On-Die ECC




CAS latency

Column Address Strobe (CAS) latency, or CL, is the delay time between the moment a memory controller tells the memory module to access a particular memory column on a RAM module, and the moment the data from the given array location is available on the module's output pins. In general, the lower the CAS latency, the better.

46


Internal memory

A computer's memory which is directly accessible to the CPU.
GB


Memory layout (modules x size)

How the overall memory of the product is put together, defined by the number of modules and the size.

1 x 16 GB


Internal memory type

The type of internal memory such as RAM, GDDR5.

DDR5


Memory clock speed

The frequency at which the memory (e.g. RAM) runs.

5600 MHz


Component for

What this product is used as a part of (component for).

PC


Memory form factor

Design of the memory e.g. 240-pin DIMM, SO-DIMM.

288-pin DIMM



Features


ECC

ECC means Error Correction Code, and it is memory that is able to detect and correct some memory errors without user intervention.




Memory voltage

The voltage (V) of the memory in the device.

1.1 V


JEDEC standard




Weight & dimensions


Depth

The distance from the front to the back of something.
4 mm


Height

The measurement of the product from head to foot or from base to top.

32 mm


Packaging data


Package type

The type of product package e.g. box.

Blister