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Team Group VULCAN FLBD532G6000HC30DC01 Memory Module 32 GB 2 X 16 GB DDR5 FLBD532G6000HC30DC01
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- UPC:
- 0765441868700
- MPN:
- FLBD532G6000HC30DC01
- Condition:
- New
- Availability:
- Available with FREE Delivery (usually delivered within 5-7 working days)
Description
Sleek Design
For the T-FORCE VULCAN DDR5, TEAMGROUP has adopted a gorgeous streamlines design with multi-angular to overall outline for visual aesthetics and showcase VULCAN DDR5's unique features, delivering a sleek OC gaming memory that packs a powerful performance.
Reinforced Structure
The VULCAN DDR5 is molded from a single block of aluminum alloy through stamping and the top structure is fixed with a snap fastener.
Better Cooling
TEAMGROUP uses a professional-grade thermal conducting silicon to reinforce adhesion between the cooling fin and memory. The silicon also allows for incredible cooling as it transfers the heat from top to bottom rapidly, ensuring that the memory remains at the optimal operating temperature.
Supports Intel XMP3.0 for One-Click Overclocking
Supports the latest Intel XMP3.0 and one-click overclocking technology; users can experience ultra-fast overclocking speeds at a single click.
Strengthened PMIC Cooling Design
The VULCAN DDR5 is equipped with professional thermal conductive silicon, make PMIC cooling design for more effective, and stable PMIC operations.
Power Management ICs (PMICs) Equipped for Stable, Efficient Power Usage
The VULCAN DDR5 memory is equipped with PMIC, minimizing noise interference ensuring stable, efficient power distribution across all components for rapid, and reliable power supply.
On-die ECC for Stable System
The VULCAN DDR5 memory supports on-die ECC, which offers error correction and detection to ensure that system stability is not compromised for performance.
High-Quality ICs Selected for Stability & Reliability
TEAMGROUP has selected a high-quality IC die that has undergone comprehensive compatibility and reliability testing to ensure an OC gaming memory that delivers both stability and compatibility.
Specs
Features
Buffered memory type
Unregistered (unbuffered)
On-Die ECC
CAS latency
Column Address Strobe (CAS) latency, or CL, is the delay time between the moment a memory controller tells the memory module to access a particular memory column on a RAM module, and the moment the data from the given array location is available on the module's output pins. In general, the lower the CAS latency, the better.
30
Internal memory
A computer's memory which is directly accessible to the CPU.
32 GB
Memory layout (modules x size)
How the overall memory of the product is put together, defined by the number of modules and the size.
2 x 16 GB
Internal memory type
The type of internal memory such as RAM, GDDR5.
DDR5
Memory clock speed
The frequency at which the memory (e.g. RAM) runs.
6000 MHz
Component for
What this product is used as a part of (component for).
PC
Memory form factor
Design of the memory e.g. 240-pin DIMM, SO-DIMM.
288-pin DIMM
ECC
ECC means Error Correction Code, and it is memory that is able to detect and correct some memory errors without user intervention.
Memory voltage
The voltage (V) of the memory in the device.
1.35 V
Intel Extreme Memory Profile (XMP)
Features
Intel Extreme Memory Profile (XMP) version
3.0
Sequential bandwidth - 100% read (up to)
48000 MB/s
Product colour
The colour e.g. red, blue, green, black, white.
Black
Cooling type
The method used to cool the device or to cool the air around the device.
Heatsink
Technical details
Compliance certificates
CE, RoHS, UKCA
Sustainability
Sustainability compliance
Weight & dimensions
Width
The measurement or extent of something from side to side.
7.5 mm
Depth
The distance from the front to the back of something.
0 mm
Height
The measurement of the product from head to foot or from base to top.
32.7 mm
View AllClose
For the T-FORCE VULCAN DDR5, TEAMGROUP has adopted a gorgeous streamlines design with multi-angular to overall outline for visual aesthetics and showcase VULCAN DDR5's unique features, delivering a sleek OC gaming memory that packs a powerful performance.
Reinforced Structure
The VULCAN DDR5 is molded from a single block of aluminum alloy through stamping and the top structure is fixed with a snap fastener.
Better Cooling
TEAMGROUP uses a professional-grade thermal conducting silicon to reinforce adhesion between the cooling fin and memory. The silicon also allows for incredible cooling as it transfers the heat from top to bottom rapidly, ensuring that the memory remains at the optimal operating temperature.
Supports Intel XMP3.0 for One-Click Overclocking
Supports the latest Intel XMP3.0 and one-click overclocking technology; users can experience ultra-fast overclocking speeds at a single click.
Strengthened PMIC Cooling Design
The VULCAN DDR5 is equipped with professional thermal conductive silicon, make PMIC cooling design for more effective, and stable PMIC operations.
Power Management ICs (PMICs) Equipped for Stable, Efficient Power Usage
The VULCAN DDR5 memory is equipped with PMIC, minimizing noise interference ensuring stable, efficient power distribution across all components for rapid, and reliable power supply.
On-die ECC for Stable System
The VULCAN DDR5 memory supports on-die ECC, which offers error correction and detection to ensure that system stability is not compromised for performance.
High-Quality ICs Selected for Stability & Reliability
TEAMGROUP has selected a high-quality IC die that has undergone comprehensive compatibility and reliability testing to ensure an OC gaming memory that delivers both stability and compatibility.
Specs
Features
Buffered memory type
Unregistered (unbuffered)
On-Die ECC
CAS latency
Column Address Strobe (CAS) latency, or CL, is the delay time between the moment a memory controller tells the memory module to access a particular memory column on a RAM module, and the moment the data from the given array location is available on the module's output pins. In general, the lower the CAS latency, the better.
30
Internal memory
A computer's memory which is directly accessible to the CPU.
32 GB
Memory layout (modules x size)
How the overall memory of the product is put together, defined by the number of modules and the size.
2 x 16 GB
Internal memory type
The type of internal memory such as RAM, GDDR5.
DDR5
Memory clock speed
The frequency at which the memory (e.g. RAM) runs.
6000 MHz
Component for
What this product is used as a part of (component for).
PC
Memory form factor
Design of the memory e.g. 240-pin DIMM, SO-DIMM.
288-pin DIMM
ECC
ECC means Error Correction Code, and it is memory that is able to detect and correct some memory errors without user intervention.
Memory voltage
The voltage (V) of the memory in the device.
1.35 V
Intel Extreme Memory Profile (XMP)
Features
Intel Extreme Memory Profile (XMP) version
3.0
Sequential bandwidth - 100% read (up to)
48000 MB/s
Product colour
The colour e.g. red, blue, green, black, white.
Black
Cooling type
The method used to cool the device or to cool the air around the device.
Heatsink
Technical details
Compliance certificates
CE, RoHS, UKCA
Sustainability
Sustainability compliance
Weight & dimensions
Width
The measurement or extent of something from side to side.
7.5 mm
Depth
The distance from the front to the back of something.
0 mm
Height
The measurement of the product from head to foot or from base to top.
32.7 mm
Additional Information
Shipping: |
Usually shipped within 3-5 working days |
Delivery: |
Usually delivered within 5-7 working days |
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