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Team Group XTREEM FFXD532G7600HC36FDC01 Memory Module 32 GB 2 X 16 GB DDR5 ECC FFXD532G7600HC36FDC01
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- UPC:
- 4711430800899
- MPN:
- FFXD532G7600HC36FDC01
- Condition:
- New
- Availability:
- Available with FREE Delivery (usually delivered within 5-7 working days)
Description
Honorable T-FORCE Logo exceeds overclocking limits
With T-FORCE LAB-s superb R&D capability, the brand-new T-FORCE XTREEM DDR5 exceeds the frequency limit of DDR5 memory. The product has T-FORCE logo symbolizing our utmost pride, showcasing its exceptional existence, it is definitely the best choice in the world of overclocking products.
Meticulously layered high-quality aluminum sandblasted fins for exceptional heat dissipation
Inspired by the image of energy conversion between the hot and cold under high temperatures from a volcano, the exterior and looks of T-FORCE XTREEM DDR5 has meticulously layered high-quality aluminum sandblasted fins resembling the texture of basalt and the beach, delivering exceptional heat dissipation capabilities. The surface is etched with T-FORCE logo to certify its excellence.
Sturdy 2mm heat sink for perfect heat dissipation improvement
T-FORCE XTREEM DDR5 adopts 2mm aluminum alloy heat spreader to increase its quality and heat capacity. The product also has thermal gap pad with high thermal conductivity to strengthen PMIC heat dissipation effects, coupled with anti-acid, alkaline, rust and inconducive anodic treatment on the surface to deliver perfect heat dissipation performance overall.
High-quality IC with patented technique
Uses our proprietary IC grading testing validation technique-GRADING METHOD FOR MEMORY (Invention patent number in Taiwan: I751093; Invention patent number in USA: US11488679B1) to develop DDR5 high-performance memory module successfully.
Power management chip for stable and effective power usage
Power management chip minimizes noise interference, stabilizes power and distributes power to each electronic component effectively, supplying power to the system with stability and fastness.
On-Die ECC for a more stable system
Supported with On-die ECC providing error correction and detection, the mechanism stabilizes the system while pursing performance.
Specs
Features
Buffered memory type
Registered (buffered)
On-Die ECC
CAS latency
Column Address Strobe (CAS) latency, or CL, is the delay time between the moment a memory controller tells the memory module to access a particular memory column on a RAM module, and the moment the data from the given array location is available on the module's output pins. In general, the lower the CAS latency, the better.
36
Internal memory
A computer's memory which is directly accessible to the CPU.
32 GB
Memory layout (modules x size)
How the overall memory of the product is put together, defined by the number of modules and the size.
2 x 16 GB
Internal memory type
The type of internal memory such as RAM, GDDR5.
DDR5
Memory clock speed
The frequency at which the memory (e.g. RAM) runs.
7600 MHz
Component for
What this product is used as a part of (component for).
PC
Memory form factor
Design of the memory e.g. 240-pin DIMM, SO-DIMM.
288-pin DIMM
Features
ECC
ECC means Error Correction Code, and it is memory that is able to detect and correct some memory errors without user intervention.
Memory voltage
The voltage (V) of the memory in the device.
1.4 V
Cooling type
The method used to cool the device or to cool the air around the device.
Heatsink
Weight & dimensions
Width
The measurement or extent of something from side to side.
8.2 mm
Depth
The distance from the front to the back of something.
4.5 mm
Height
The measurement of the product from head to foot or from base to top.
48.8 mm
Packaging data
Package type
The type of product package e.g. box.
Box
View AllClose
With T-FORCE LAB-s superb R&D capability, the brand-new T-FORCE XTREEM DDR5 exceeds the frequency limit of DDR5 memory. The product has T-FORCE logo symbolizing our utmost pride, showcasing its exceptional existence, it is definitely the best choice in the world of overclocking products.
Meticulously layered high-quality aluminum sandblasted fins for exceptional heat dissipation
Inspired by the image of energy conversion between the hot and cold under high temperatures from a volcano, the exterior and looks of T-FORCE XTREEM DDR5 has meticulously layered high-quality aluminum sandblasted fins resembling the texture of basalt and the beach, delivering exceptional heat dissipation capabilities. The surface is etched with T-FORCE logo to certify its excellence.
Sturdy 2mm heat sink for perfect heat dissipation improvement
T-FORCE XTREEM DDR5 adopts 2mm aluminum alloy heat spreader to increase its quality and heat capacity. The product also has thermal gap pad with high thermal conductivity to strengthen PMIC heat dissipation effects, coupled with anti-acid, alkaline, rust and inconducive anodic treatment on the surface to deliver perfect heat dissipation performance overall.
High-quality IC with patented technique
Uses our proprietary IC grading testing validation technique-GRADING METHOD FOR MEMORY (Invention patent number in Taiwan: I751093; Invention patent number in USA: US11488679B1) to develop DDR5 high-performance memory module successfully.
Power management chip for stable and effective power usage
Power management chip minimizes noise interference, stabilizes power and distributes power to each electronic component effectively, supplying power to the system with stability and fastness.
On-Die ECC for a more stable system
Supported with On-die ECC providing error correction and detection, the mechanism stabilizes the system while pursing performance.
Specs
Features
Buffered memory type
Registered (buffered)
On-Die ECC
CAS latency
Column Address Strobe (CAS) latency, or CL, is the delay time between the moment a memory controller tells the memory module to access a particular memory column on a RAM module, and the moment the data from the given array location is available on the module's output pins. In general, the lower the CAS latency, the better.
36
Internal memory
A computer's memory which is directly accessible to the CPU.
32 GB
Memory layout (modules x size)
How the overall memory of the product is put together, defined by the number of modules and the size.
2 x 16 GB
Internal memory type
The type of internal memory such as RAM, GDDR5.
DDR5
Memory clock speed
The frequency at which the memory (e.g. RAM) runs.
7600 MHz
Component for
What this product is used as a part of (component for).
PC
Memory form factor
Design of the memory e.g. 240-pin DIMM, SO-DIMM.
288-pin DIMM
Features
ECC
ECC means Error Correction Code, and it is memory that is able to detect and correct some memory errors without user intervention.
Memory voltage
The voltage (V) of the memory in the device.
1.4 V
Cooling type
The method used to cool the device or to cool the air around the device.
Heatsink
Weight & dimensions
Width
The measurement or extent of something from side to side.
8.2 mm
Depth
The distance from the front to the back of something.
4.5 mm
Height
The measurement of the product from head to foot or from base to top.
48.8 mm
Packaging data
Package type
The type of product package e.g. box.
Box
Additional Information
Shipping: |
Usually shipped within 3-5 working days |
Delivery: |
Usually delivered within 5-7 working days |
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Honorable T-FORCE Logo exceeds overclocking limits With T-FORCE LAB-s superb R&D capability, the brand-new T-FORCE XTREEM DDR5 exceeds the frequency limit of DDR5 memory. The product has T-FORCE...