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XPG LANCER BLADE Memory Module 16 GB 1 X 16 GB DDR5 6000 MT/s ECC AX5U6C316SLABBK
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- UPC:
- 4711085944535
- MPN:
- AX5U6C316SLABBK
- Condition:
- New
- Availability:
- Available with FREE Delivery (usually delivered within 5-7 working days)
Description
LANCER BLADE DDR5
SLEEK EFFICIENCY, COMPACT POWER
Compact Low-Profile Heatsink Design
The LANCER BLADE boasts a low-profile heatsink that fits perfectly in smaller PC cases and avoids interference with tower CPU coolers. Its sleek geometric lines add versatility and visual appeal to any case design.
Enhanced Power Management
The XPG LANCER BLADE DDR5 features a built-in Power Management IC (PMIC) that enhance power supply stability. It's lower operating voltage also make LANCER more power-efficient than DDR4.
Stability and Reliability
With On-die error correcting code (ECC), this DDR5 memory module can correct errors in real-time to provide increased stability and reliability.
Made with High-Quality Materials
High-quality ICs and PCBs ensure uncompromised performance and reliable overclocking, ideal for discerning gamers and overclockers.
AMD EXPO
Support for AMD EXPO (EXtended Profiles for Overclocking) and compatibility with the latest platforms for reliability and stability.
Overclocking Made Easy
With support for Intel XMP 3.0, get overclocking easily without the need to hassle with BIOS settings. There is no need to repeatedly adjust and fine-tune overclocking parameters.
Specs
Features
On-Die ECC
CAS latency
Column Address Strobe (CAS) latency, or CL, is the delay time between the moment a memory controller tells the memory module to access a particular memory column on a RAM module, and the moment the data from the given array location is available on the module's output pins. In general, the lower the CAS latency, the better.
30
Internal memory
A computer's memory which is directly accessible to the CPU.
GB
Memory layout (modules x size)
How the overall memory of the product is put together, defined by the number of modules and the size.
1 x 16 GB
Internal memory type
The type of internal memory such as RAM, GDDR5.
DDR5
Memory data transfer rate
6000 MT/s
Component for
What this product is used as a part of (component for).
PC
ECC
ECC means Error Correction Code, and it is memory that is able to detect and correct some memory errors without user intervention.
Memory voltage
The voltage (V) of the memory in the device.
1.35 V
Intel Extreme Memory Profile (XMP)
Intel Extreme Memory Profile (XMP) version
3.0
AMD Extended Profiles for Overclocking (EXPO)
Cooling type
The method used to cool the device or to cool the air around the device.
Heatsink
Operational conditions
Operating temperature (T-T)
The minimum and maximum temperatures at which the product can be safely operated.
0 - 85 °C
Storage temperature (T-T)
The minimum and maximum temperatures at which the product can be safely stored.
-20 - 65 °C
Weight & dimensions
Width
The measurement or extent of something from side to side.
3.3 mm
Depth
The distance from the front to the back of something.
33.8 mm
Height
The measurement of the product from head to foot or from base to top.
7.8 mm
Weight
Weight of the product without packaging (net weight). If possible, the net weight is given including standard accessories and supplies. Please note that sometimes the manufacturer leaves out the weight of accessories and/or supplies.
32.92 g
Packaging data
Package width
The distance from one side of the packaging to the other.
70 mm
Package depth
The distance from the front to the back of the packaging.
0 mm
Package height
The distance from the top to the bottom of the packaging.
.2 mm
Package weight
Weight of the packaged product.
51.64 g
Package type
The type of product package e.g. box.
Blister
View AllClose
SLEEK EFFICIENCY, COMPACT POWER
Compact Low-Profile Heatsink Design
The LANCER BLADE boasts a low-profile heatsink that fits perfectly in smaller PC cases and avoids interference with tower CPU coolers. Its sleek geometric lines add versatility and visual appeal to any case design.
Enhanced Power Management
The XPG LANCER BLADE DDR5 features a built-in Power Management IC (PMIC) that enhance power supply stability. It's lower operating voltage also make LANCER more power-efficient than DDR4.
Stability and Reliability
With On-die error correcting code (ECC), this DDR5 memory module can correct errors in real-time to provide increased stability and reliability.
Made with High-Quality Materials
High-quality ICs and PCBs ensure uncompromised performance and reliable overclocking, ideal for discerning gamers and overclockers.
AMD EXPO
Support for AMD EXPO (EXtended Profiles for Overclocking) and compatibility with the latest platforms for reliability and stability.
Overclocking Made Easy
With support for Intel XMP 3.0, get overclocking easily without the need to hassle with BIOS settings. There is no need to repeatedly adjust and fine-tune overclocking parameters.
Specs
Features
On-Die ECC
CAS latency
Column Address Strobe (CAS) latency, or CL, is the delay time between the moment a memory controller tells the memory module to access a particular memory column on a RAM module, and the moment the data from the given array location is available on the module's output pins. In general, the lower the CAS latency, the better.
30
Internal memory
A computer's memory which is directly accessible to the CPU.
GB
Memory layout (modules x size)
How the overall memory of the product is put together, defined by the number of modules and the size.
1 x 16 GB
Internal memory type
The type of internal memory such as RAM, GDDR5.
DDR5
Memory data transfer rate
6000 MT/s
Component for
What this product is used as a part of (component for).
PC
ECC
ECC means Error Correction Code, and it is memory that is able to detect and correct some memory errors without user intervention.
Memory voltage
The voltage (V) of the memory in the device.
1.35 V
Intel Extreme Memory Profile (XMP)
Intel Extreme Memory Profile (XMP) version
3.0
AMD Extended Profiles for Overclocking (EXPO)
Cooling type
The method used to cool the device or to cool the air around the device.
Heatsink
Operational conditions
Operating temperature (T-T)
The minimum and maximum temperatures at which the product can be safely operated.
0 - 85 °C
Storage temperature (T-T)
The minimum and maximum temperatures at which the product can be safely stored.
-20 - 65 °C
Weight & dimensions
Width
The measurement or extent of something from side to side.
3.3 mm
Depth
The distance from the front to the back of something.
33.8 mm
Height
The measurement of the product from head to foot or from base to top.
7.8 mm
Weight
Weight of the product without packaging (net weight). If possible, the net weight is given including standard accessories and supplies. Please note that sometimes the manufacturer leaves out the weight of accessories and/or supplies.
32.92 g
Packaging data
Package width
The distance from one side of the packaging to the other.
70 mm
Package depth
The distance from the front to the back of the packaging.
0 mm
Package height
The distance from the top to the bottom of the packaging.
.2 mm
Package weight
Weight of the packaged product.
51.64 g
Package type
The type of product package e.g. box.
Blister
Additional Information
Shipping: |
Usually shipped within 3-5 working days |
Delivery: |
Usually delivered within 5-7 working days |
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